Semiconductor packaging, glue dropping; PCB electronic parts fixing and protection; LCD glass machine board packaging and bonding; mobile phone board coating or button glue dropping; speaker glue dropping; battery box glue dropping; automobile parts coating glue dropping; hardware parts coating glue dropping; quantitative gas and liquid filling coating Cloth; chip binding and dispensing
Model |
JT-HPD400 |
Working Range X/Y/Z-Axis(mm) |
400*400*100 |
Max Load Y-Z Axis |
10 KG |
Moving speed (mm/sec) |
0.1~600 |
Resolution |
0.01mm/Axis |
Repetitive positioning accuracy |
+/-0.01mm/Axis |
Motor system |
Japanese Servo Motor |
Driving method |
Rolling ball screw |
Interpolation function |
3 axis(3D) |
Programming method |
Software (PC) or Control Handle |
I/O Signals port |
8 I/O |
External interface |
USB |
Power |
AC220V 50/60HZ |
Working temperature |
10~40℃ |
Working relative humidity |
20~90% |
Dimensions(W*D*H) |
980*1523*1630mm |
Weight |
550Kg |
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